This image shows Steffen Kieß

Steffen Kieß


Research Assistant
Computational Imaging Systems


+49 711 685 88396
+49 711 685 88250

Universitätsstraße 38
70569 Stuttgart
Room: 2.256

Office Hours

on appointment

  1. 2022

    1. Computational Scatter Correction for High-Resolution Flat-Panel CT Based on a Fast Monte Carlo Photon Transport Model. Ammar Alsaffar; Steffen Kieß; Kaicong Sun and Sven Simon. 2022.2022. DOI:
  2. 2019

    1. Spatial Resolution Enhancement Based on Detector Displacement for Computed Tomography. Kaicong Sun; Steffen Kieß and Sven Simon. In Proceedings of the 9th Conference on Industrial Computed Tomography (iCT 2019), Padova, Italy, 2019, pp. 1--8.
  3. 2018

    1. Efficient Data Structures for the Fast 3D Reconstruction of Voxel Volumes with Inhomogeneous Spatial Resolution. Benjamin Betz; Steffen Kieß; Michael Krumm; Gunnar Knuppe; Tsegaye Eshete and Sven Simon. In 8th Conference on Industrial Computed Tomography (iCT), Wels, Austria, 2018.
  4. 2017

    1. Contactless characterization of electric structures with simulation models based on CT data. C. Jauch; J. Denecke; J. Kuehnle; I. Effenberger; S. Kiess and S. Simon. In 7th Conference on Industrial Computed Tomography, 2017, pp. 1–7.
  5. 2015

    1. Signal Integrity Model Extraction Based on Computed Tomography Scans—Analysis of the Required Voxel Resolution. Jürgen Hillebrand; Steffen Kieß; Jajnabalkya Guhathakurta and Sven Simon. IEEE Transactions on Electromagnetic Compatibility 57, 4 (2015), pp. 847–857. DOI:
  6. 2012

    1. S-parameter extraction of bond wires based on EM field simulations of computed tomography-generated 3D CAD models. Jürgen Hillebrand; Steffen Kieß; Marek Wróblewski and Sven Simon. In 2012 IEEE 16th Workshop on Signal and Power Integrity (SPI), 2012, pp. 39–42. DOI:
    2. On the Estimation of Numerical Error Bounds in Linear Algebra Based on Discrete Stochastic Arithmetic. W. Li; S. Simon and S. Kiess. Journal: Applied Numerical Mathematics 62, 5 (2012), pp. 536–555.
  7. 2011

    1. CAD model reconstruction of solder balls for the computationally efficient electromagnetic field simulation. Jürgen Hillebrand; Steffen Kieß; Yu Wang; Marek Wróblewski and Sven Simon. In 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 2011, pp. 279–282. DOI:
    2. S-parameter extraction of passive sub-circuits using computed tomography scans and measured substrate material parameters. Jürgen Hillebrand; Steffen Kieß; Marek Wróblewski and Sven Simon. In 78th ARFTG Microwave Measurement Conference, 2011, pp. 1–6. DOI:
    3. In-process optical characterization method for sub-100-nm nanostructures. S. Kieß; M. Z. Shaikh; M. Grégoire; T. Bringewat; S. Simon; A. Tausendfreund; M. Zimmermann and G. Goch. In 2011 IEEE International Instrumentation and Measurement Technology Conference, 2011, pp. 1–4. DOI:
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