This picture showsHussam Amrouch

Jun.-Prof. Dr.-Ing.

Hussam Amrouch

Head of Chair of Semiconductor Test and Reliability
Institute of Computer Architecture and Computer Engineering
Semiconductor Test and Reliability

Contact

+49 711 685-88393
+49 711 685-88288

Pfaffenwaldring 47
D-70569 Stuttgart
Germany
Room: 3.163

Subject

Short Bio

Dr. Hussam Amrouch is a Junior Professor at the University of Stuttgart  heading the Chair of Semiconductor Test and Reliability (STAR). He earned in 06.2015 his Ph.D. degree in Computer Science (Dr.-Ing.) from the Karlsruhe Institute of Technology (KIT), Germany with distinction (summa cum laude). After which, he has founded and led the “Dependable Hardware” research group at KIT. Dr. Amrouch has published so far 100 multidisciplinary publications, including 34 journals, covering all major research areas across the computing stack (semiconductor physics, circuit design, computer architecture, and computer-aided design). His key research interests are focused on design for reliability from device physics to systems, emerging nanotechnologies, machine learning for CAD, approximate computing, and deep neural networks.

Dr. Amrouch currently serves as Associate Editor in Integration, the VLSI Journal and. He is a reviewer in many top journals and he is/was a Technical Program Committee (TPC) member for several leading international conferences in the computer science area like Design Automation Conference (DAC), International Conference on Design Automation Computer-Aided Design (ICCAD) and others. In January 2018, an article in the Frankfurt General Newspaper (Frankfurter Allgemeine Zeitung - FAZ) was published recognizing his research and later in the same year, he was interviewed by the German public broadcasting radio (Deutschlandfunk) regarding his findings in thermal side channel attacks in cyber-physical systems.

Dr. Amrouch has delivered 7 tutorial talks in several major EDA conferences like DAC and DATE as well as 16 invited talks including 2 Keynotes in several international conferences, workshops, universities, and companies. His research currently is funded by the German Research Foundation (DFG), Advantest which a leading manufacturer of test equipment for the semiconductor industry, and the Office of Naval Research (ONR).

Key Research Interests and Fields

1. Machine Learning for Computer-Aided Design (MLCAD): Funded by Advantest
  • ML for Design for Reliability and Design for Testing.
  • ML for Circuit Thermal and Reliability Modeling.
  • ML for Transistor Compact Modeling.
2. Approximate Computing for Deep Neural Network Acceleration: Funded by DFG
  • Approximate Computing for Efficient Implementation of Neural Processing Units.
  • Approximate Computing for Reliability Management.
3. Design for Security for Cyber-Physical Systems: Funded by ONR U.S.
  • Reliability Degradation-induced Security Threats.
  • Short-Term Circuit Aging for Hardware Trojan Detection.
4. Design for Reliability in Advanced Nanotechnologies
  • Advanced CMOS Technology: Nanosheet and Nanowire Transistors.
  • Device-Circuit Interaction: Transistor Aging, Self-Heating, Process Variation, Soft Errors
  • Reliability-Aware and Thermal-Aware System-on-Chip Design.
5. Emerging Technologies for Future Computer Architectures
  • Post-CMOS Technology: Negative Capacitance Transistor (NCFET).
  • Novel Non-Volatile Memories: Ferroelectric FET (FeFET).
  • In-Memory Computing and Neuromorphic Computing.
6. Thermal Management for Many-Core Processors
  • Advanced Cooling Solutions using Thermoelectric Devices.
  • Resource Management for System-Level Optimizations.

Ongoing International Collaborations

1. Semiconductor Physics:
  • Indian Institute of Technology, Bombay, India: Prof. Souvik Mahapatra.
  • Peking University, Beijing, China: Prof. Runsheng Wang.
2. Device-Level:
  • University of Berkeley, California, USA: Dr. Girish Pahwa.
  • Rochester Institute of Technology, USA: Prof. Kai Ni.
  • Indian Institute of Technology Kanpur, India: Prof. Yogesh S. Chauhan.
3. Circuit-Level:
  • University of Notre Dame, USA: Prof. Xiaobo Sharon Hu.
  • National Chiao Tung University, Taiwan: Prof. Hung-Ming Chen.
  • New York University Abu Dhabi, UAE: Dr. Johann Knechtel, Prof. Ozgur Sinanoglu.
  • Federal University of Rio Grande do Sul, Brazil: Prof. Sergio Bampi.
4. System-Level:
  • New York University (NYU), USA: Prof. Ramish Karri and Prof. Farshad Khorrami.
  • University of Texas at Austin (UT), USA: Prof. Andreas Gerstlauer.
  • University of California, Riverside (UCR), USA: Prof. Sheldon Tan.
  • National University of Singapore (NUS), Singapore: Prof. Tulika Mitra.
  • University of Nebraska–Lincoln (UNL), USA: Prof. Marilyn Wolf.
  • University of New South Wales (UNSW), Australia: Prof. Sri Parameswaran.
  • Korea University, Seoul, South Korea: Prof. Sung Woo Chung.
  1. article

    1. On the Resiliency of NCFET Circuits against Voltage  Over-Scaling. Guilherme Paim; Georgios Zervakis; Eduardo A. C. da Costa; Sergio Bampi; Jörg Henkel and Hussam Amrouch. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I’21) (2021).
    2. Containing Self-Heating Effects in Advanced Technologies. S. Salamin; V. van Santen; M. Rapp; J. Henkel and H. Amrouch. The Multidisciplinary Open Access Journal IEEE Access (IEEE Access’21) (2021).
    3. Exposing Hardware Trojans in Embedded Platforms via Short-Term Aging. V. Surabhi; P. Krishnamurthy; H. Amrouch; R. Henkel J. Karri and F. Khorrami. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD’20), ESWEEK Special Issue (2020).
    4. Power Side-Channel Attacks in Negative Capacitance Transistor (NCFET). J. Knechtel; S. Patnaik; M. Nabeel; M. Ashraf; Y. Chauhan; J. Henkel; O. Sinanoglu and H. Amrouch. IEEE Micro Magazine (MICRO’20) (2020).
    5. Dynamic Power and Energy Management for NCFET-based Processors. Sami Salamin; Martin Rapp; Andreas Gerstlauer; Joerg Henkel and Hussam Amrouch. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD’20), ESWEEK Special Issue (2020).
    6. Design Automation of Approximate Circuits With Runtime Reconfigurable Accuracy. G. Zervakis; H. Amrouch and J. Henkel. The Multidisciplinary Open Access Journal IEEE Access (IEEE Access) (2020).
    7. Massively Parallel Circuit Setup in GPU-SPICE. V. van Santen; F. Florian Diep; J. Henkel and H. Amrouch. IEEE Transactions on Computers (TC’20) (2020).
    8. A Framework for Crossing Temperature-Induced Timing Errors  Underlying Hardware Accelerators to the Algorithm and Application Layers. G. Paim; H. Amrouch; L. Rocha; B. Abreu; E. da Costa; S. Bampi and J. Henkel. IEEE Transactions on Computers (TC’20) (2020).
    9. Weight-Oriented Approximation for Energy-Efficient Neural  Network Inference Accelerators. Zois-Gerasimos Tasoulas; Georgios Zervakis; Iraklis Anagnostopoulos; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Circuits and Systems I: Regular Papers  (TCAS-I) (2020).
    10. Impact of Interface Traps on Negative Capacitance Transistor:  Device and Circuit Reliability. Om Prakash; Anekit Gupta; Girish Pahwa; Joerg Henkel; Yogesh S. Chauhan and Hussam Amrouch. IEEE Journal of the Electron Devices Society (JEDS’20) (2020).
    11. Power-Efficient Heterogeneous Many-Core Design with NCFET Technology. S. Salamin; M. Rapp; A. Pathania; A. Maity; J. Henkel; T. Mitra and H. Amrouch. IEEE Transactions on Computers (TC’20) (2020).
    12. Impact of Variability on Processor Performance in Negative Capacitance FinFET Technology. H. Amrouch; G. Pahwa; A. Gaidhane; F. Klemme; O. Prakash; C. Dabhi and Y. Chauhan. IEEE Transactions on Circuits and Systems I: Regular Paper  (TCAS-I’20), 2020 (2020).
    13. NPU Thermal Management. Hussam Amrouch; Georgios Zervakis; Kattan; Hammam; Iraklis Anagnostopoulos and Joerg Henkel. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD’20), ESWEEK Special Issue (2020).
    14. Aging Compensation with Dynamic Computation Approximation. H. Kim; J. Kim; H. Amrouch; Jörg Henkel; A. Gerstlauer; K. Choi and P. Hanmin. IEEE Transactions on Circuits and Systems I: Regular Paper  (TCAS-I’20) (2020).
    15. Towards a New Thermal Monitoring Based Framework for Embedded CPS Device Security. N. Patel; P. Krishnamurthy; H. Amrouch; J. Henkel; M. Shamouilian; R. Karri and Khorrami. R. IEEE Transactions on Dependable and Secure Computing  (TDSC’20) (2020).
    16. Post-Silicon Hot-Spot Identification and Machine-LearningBased Thermal Modeling Using Infrared Thermal Imaging. S. M Sheriff; Z. Jinwei; Z. Hengyang; Amrouch; H.; Jörg Henkel and S. Tan. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD’20) (2020).
    17. Hardware Trojan Detection Using Controlled Circuit Aging. V. Surabhi; P. Krishnamurthy; H. Amrouch; K. Basu; R. Henkel J. Karri and F. Khorrami. The Multidisciplinary Open Access Journal IEEE Access (IEEE Access) (2020).
    18. New Worst-Case Timing for Standard Cells Under Aging Effects. Victor M van Santen; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Device and Materials Reliability (T-DMR’19) 19, 1 (2019), pp. 149--158.
    19. Modeling and Mitigating Time-Dependent Variability From the Physical Level to the Circuit Level. Victor M van Santen; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I’19) (2019).
    20. On the Workload Dependence of Self-Heating in FinFET Circuits. Victor M van Santen; Hussam Amrouch; Pooja Sharma and Jörg Henkel. IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II’19) (2019).
    21. A Cross-layer Gate-Level-to-Application Co-simulation for Design Space Exploration of Approximate Circuits in HEVC Video Encoders. Guilherme Paim; Leandro M. G. Rocha; Hussam Amrouch; A. C. da Costa Eduardo; Sergio Bampi and Jörg Henkel. IEEE Transactions on Circuits and Systems for Video Technology  (TCSVT’19) (2019).
    22. Device to Circuit Framework for Activity-Dependent NBTI Aging in Digital Circuits. A Thirunavukkarasu; Hussam Amrouch; Jerin Joe; Nilesh Goel; Narendra Parihar; Subrat Mishra; Chetan K Dabhi; Yogesh S Chauhan; Jörg Henkel and Souvik Mahapatra. IEEE Transactions on Electron Devices (T-ED’19) 66, 1 (2019), pp. 316--323.
    23. Unveiling the Impact of IR-drop on Performance Gain in NCFET-based Processors. Hussam Amrouch; Sami Salamin; Girish Pahwa; Amol D Gaidhane; Jörg Henkel and Yogesh S Chauhan. IEEE Transactions on Electron Devices (T-ED’19) (2019).
    24. A simulation study of NBTI impact on 14-nm node FinFET technology for logic applications: Device degradation to circuit-level interaction. Subrat Mishra; Hussam Amrouch; Jerin Joe; Chetan K Dabhi; Karansingh Thakor; Yogesh S Chauhan; Jörg Henkel and Souvik Mahapatra. IEEE Transactions on Electron Devices (T-ED’19) 66, 1 (2019), pp. 271--278.
    25. Estimating and Mitigating Aging Effects in Routing Network of FPGAs. Behnam Khaleghi; Behzad Omidi; Hussam Amrouch; Jörg Henkel and Hossein Asadi. IEEE Transactions on Very Large Scale Integration Systems (TVLSI’19) 27, 3 (2019), pp. 651--664.
    26. On the Efficiency of Voltage Overscaling under Temperature and Aging Effects. Hussam Amrouch; Borna Ehsani; Andreas Gerstlauer and Jörg Henkel. IEEE Transactions on Computers (TC’19) (2019).
    27. Dynamic guardband selection: Thermal-aware optimization for unreliable multi-core systems. Heba Khdr; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Computers (TC’19) 68, 1 (2019), pp. 53--66.
    28. Modeling the Interdependences Between Voltage Fluctuation and BTI Aging. Sami Salamin; Victor M van Santen; Hussam Amrouch; Narendra Parihar; Souvik Mahapatra and Jörg Henkel. IEEE Transactions on Very Large Scale Integration Systems (TVLSI’19) (2019).
    29. Recent Advances in EM and BTI Induced Reliability Modeling, Analysis and Optimization. Sheldon X.-D. Tan; Hussam Amrouch; Taeyoung Kim; Zeyu Sun; Chase Cook and Jrg Henkel. Integration VLSI Journal (IVLSI’18) 60, C (2018), pp. 132--152.
    30. Aging-Aware Boosting. H. Khdr; H. Amrouch and J. Henkel. IEEE Transactions on Computers (TC’18) 67, 9 (2018), pp. 1217–1230.
    31. Reliability in Super- and Near-Threshold Computing: A Unified Model of RTN, BTI, and PV. V. M. van Santen; J. Martin-Martinez; H. Amrouch; M. M. Nafria and J. Henkel. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I’18) 65, 1 (2018), pp. 293–306.
    32. Modeling and Evaluating the Gate Length Dependence of BTI. Victor M van Santen; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II’18) (2018).
    33. Negative capacitance transistor to address the fundamental limitations in technology scaling: Processor performance. Hussam Amrouch; Girish Pahwa; Amol D Gaidhane; Jörg Henkel and Yogesh Singh Chauhan. The Multidisciplinary Open Access Journal IEEE Access (IEEE Access’18) 6, (2018), pp. 52754--52765.
    34. Interdependencies of Degradation Effects and Their Impact on Computing. H. Amrouch; V. M. van Santen and J. Henkel. IEEE Design and Test Magazine (DNT’17) 34, 3 (2017), pp. 59–67.
    35. RESI: Register-Embedded Self-Immunity for Reliability Enhancement. H. Amrouch; T. Ebi and J. Henkel. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD’14) 33, 5 (2014), pp. 677–690.
  2. inbook

    1. Impact of Negative Capacitance Field-Effect Transistor (NCFET) on Many-Core Systems. Hussam Amrouch; Martin Rapp; Sami Salamin and Jörg Henkel. In A Journey of Embedded and Cyber-Physical Systems. Springer, Cham, 2020, pp. 107.
    2. Analysis of Digital Logic Circuit Degradation. Subrat Misra; Thirunavukkarasu Vignesh; Jerin Joe; Hussam Amrouch; Jörg Henkel and Souvik Mahapatra. In Recent Advances in Negative Bias Temperature Instability, Souvik Mahapatra (ed.). Springer International Publishing, 2020.
    3. Aging Effects: From Physics to CAD. Hussam Amrouch; Heba Khdr and Jörg Henkel. In Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms: A Cross-layer Approach, William Fornaciari and Dimitrios Soudris (eds.). Springer International Publishing, 2019, pp. 43--69. DOI: https://doi.org/10.1007/978-3-319-91962-1_3
  3. inproceedings

    1. On the Critical Role of Ferroelectric Thickness for Negative Capacitance Transistor Optimization. Om Prakash; Aniket Gupta; Girish Pahwa; Yogesh Chauhan and Hussam Amrouch. In IEEE Electron Devices Technology & Manufacturing Conference    (EDTM’21), 2021.
    2. Soft Errors in Negative Capacitance FDSOI SRAMs. Govind Bajpai; Aniket Gupta; Om Prakash; Yogesh Chauhan and Hussam Amrouch. In IEEE Electron Devices Technology & Manufacturing Conference    (EDTM’21), 2021.
    3. Reliability-Aware Quantization for Anti-Aging NPUs. Sami Salamin; Georgios Zervakis; Ourania Spantidi; Iraklis Anagnostopoulos; Jörg Henkel and Hussam Amrouch. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’21), Virtual Event, 2021.
    4. Approximate Computing for ML: State-of-the-art, Challenges and  Visions. Georgios Zervakis; Hassaan Saadat; Hussam Amrouch; Andreas Gerstlauer; Sri Parameswaran and Joerg Henkel. In 26th Asia and South Pacific Design Automation Conference  (ASP-DAC’21), 2021.
    5. Cross-layer Design for Computing-in-Memory: From Devices,  Circuits, to Architectures and Applications. Hussam Amrouch; Xiaobo Sharon Hu; Mohsen Imani; Ann Franchesca Laguna; Michael Niemier; Simon Thomann; Xunzhao Yin and Cheng Zhuo. In 26th Asia and South Pacific Design Automation Conference  (ASP-DAC’21), 2021.
    6. Traps Based Reliability Barrier on Performance and Revealing  Early Ageing in Negative Capacitance (NC) FET. Nitanshu Chauhan; Aniket Gupta; Govind Bajapi; Priynshi Singhal; Navjeet Bagga; Om Prakash; Shashank Banchhor and Hussam Amrouch. In Proceedings of the IEEE 59th International Reliability Physics Symposium  (IRPS’21), Dallas, Texas, U.S., Virtual, 2021.
    7. FeFET and NCFET for Future DNNs: Visions and Opportunities. Yayla Mikail; Kuan-Hsun Chen; Christian Hakert; Georgios Zervakis; Jian-Jia Chen; Jörg Henkel and Hussam Amrouch. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’21), Virtual Event, 2021.
    8. Robust Brain-Inspired Computing: On the Reliability of  Spiking Neural Network Using Emerging Non-Volatile Synapses. Ming-Ling Wei; Hussam Amrouch; Cheng-Lin Sung; Chia-Lin Yang; Khe-Chung Wang and Chin-Yuan Lu. In Proceedings of the IEEE 59th International Reliability Physics Symposium  (IRPS’21), Dallas, Texas, U.S., Virtual, 2021.
    9. Modeling Emerging Technologies using Machine Learning:  Challenges and Opportunities. Florian Klemme; Jannik Prinz; Victor M. van Santen; Joerg Henkel and Hussam Amrouch. In IEEE/ACM 38th International Conference on Computer-Aided Design (ICCAD’20), 2020.
    10. Cell Library Characterization using Machine Learning for Design Technology Co-Optimization. Florian Klemme; Yogesh Chauhan; Joerg Henkel and Hussam Amrouch. In IEEE/ACM 38th International Conference on Computer-Aided Design (ICCAD’20), 2020.
    11. BTI and HCI Degradation in a Complete 32X64 bit SRAM Array – including Sense Amplifiers and Write Drivers – under Processor Activity. Victor van Santen; Simon Thomann; C. Pasupuleti; P. Genssler; N. Gangwar; U. Sharma; J. Henkel; S. Mahapatra and H. Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
    12. Impact of NBTI Aging on Self-Heating in Nanowire FET. Om Prakash; S. Manhas; Jörg Henkel and Hussam Amrouch. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’20), Grenoble, France, 2020.
    13. Impact of Interface Traps Induced Degradation on Negative Capacitance FinFET. Om Prakash; Aniket Gupta; Girish Pahwa; Jörg Henkel; Yogesh Chauhan and Hussam Amrouch. In IEEE Electron Devices Technology & Manufacturing Conference (EDTM’20), 2020.
    14. Energy Optimization in NCFET-based Processors. Sami Salamin; Martin Rapp; Hussam Amrouch; Andreas Gerstlauer and Jörg Henkel. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’20), Grenoble, France, 2020.
    15. Machine Learning Based Online Full-Chip Heatmap Estimation. Sheriff Sadiqbatcha; Yue Zhao; Jinwei Zhang; Hussam Amrouch; Jörg Henkel and Sheldon Tan. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20), 2020.
    16. Impact of Self-Heating On Performance, Power and Reliability in FinFET Technology. Victor M. van Santen; Paul R. Genssler; Om Prakash; S. Thomann; Jörg Henkel and Hussam Amrouch. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20, 2020.
    17. NCFET to Rescue Technology Scaling: Opportunities and Challenges. Hussam Amrouch; Victor M. van Santen; Girish Pahwa; Yogesh Chauhan and Jörg Henkel. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20), 2020.
    18. Impact of Extrinsic Variation Sources on the Device-to-Device Variation in Ferroelectric FET. Kai Ni; Aniket Gupta; Om Prakash; Simon Thomann; X. Sharon Hu and Hussam Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
    19. Temperature Dependence and Temperature-Aware Sensing in Ferroelectric FET. Aniket Gupta; Kai Ni; Om Prakash; X. Sharon Hu and Hussam Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
    20. Impact of Radiation on Negative Capacitance FinFET. Govind Bajpai; Aniket Gupta; Om Prakash; Girish Pahwa; Jörg Henkel; Yogesh Chauhan and Hussam Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
    21. The Impact of Emerging Technologies on Architectures and System-level Management. Jörg Henkel; Hussam Amrouch; Martin Rapp; Sami Salamin; Dayane Reis; Di Gao; Xunzhao Yin; Michael Niemier; Cheng Zhuo; Hu X. Sharon; Hsiang-Yun Cheng and Chia-Lin Yang. In IEEE/ACM 38th International Conference on Computer-Aided Design (ICCAD’19), 2019.
    22. NCFET-Aware Voltage Scaling. Sami Salamin; Martin Rapp; Hussam Amrouch; Girish Pahwa; Yogesh S. Chauhan and Jörg Henkel. In 2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED’19), 2019.
    23. Impact of NBTI on Increasing the Susceptibility of FinFET to Radiation. Frank Sill Torres; Hussam Amrouch; Jörg Henkel and Rolf Drechsler. In Proceedings of the IEEE 56th International Reliability Physics Symposium  (IRPS’19), Las Vegas, USA, 2019.
    24. Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging. Sheriff Sadiqbatcha; Hengyang Zhao; Hussam Amrouch; Jörg Henkel and Sheldon Tan. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’19), Florence, Italy, 2019.
    25. Rebirth-FTL: Lifetime optimization via Approximate Storage for NAND Flash. Lei Han; Hussam Amrouch; Zili Shao and Jörg Henkel. In IEEE Non-Volatile Memory Systems and Applications Symposium  (NVMSA’19), Hangzhou, China, 2019.
    26. Reliability Challenges with Self-Heating in FinFET Technology. H. Amrouch; V. M. van Santen; O. Prakash; H. Kattan; S. Salamin; S. Thomann and J. Henkel. In IEEE 25th International Symposium on On-Line Testing And Robust System Design (IOLTS’19), 2019.
    27. Performance, Power and Cooling Trade-Offs with NCFET-based Many-Cores. Martin Rapp; Sami Salamin; Hussam Amrouch; Girish Pahwa; Yogesh S. Chauhan and Jörg Henkel. In Proceedings of the 56th Annual Design Automation Conference (DAC’19), Las Vegas, USA, 2019.
    28. Aging Gracefully with Approximation. Jongho Kim; Heesu Kim; Hussam Amrouch; Jörg Henkel; Andreas Gerstlauer and Kiyoung Choi. In Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS’19), Las Vegas, USA, 2019.
    29. Selecting the Optimal Energy Point in Near-Threshold Computing. Sami Salamin; Hussam Amrouch and Jörg Henkel. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’19), Florence, Italy, 2019.
    30. Trading Off Temperature Guardbands via Adaptive Approximations. B. Boroujerdian; H. Amrouch; J. Henkel and A. Gerstlauer. In 2018 IEEE 36th International Conference on Computer Design (ICCD’18), 2018, pp. 202–209.
    31. Voltage Adaptation Under Temperature Variation. H. Amrouch; B. Khaleghi and J. Henkel. In 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD’18), 2018, pp. 57–60.
    32. Weighted time lag plot defect parameter extraction and GPU-based BTI modeling for BTI variability. V. M. van Santen; J. Diaz-Fortuny; H. Amrouch; J. Martin-Martinez; R. Rodriguez; R. Castro-Lopez; E. Roca; F. V. Fernandez; J. Henkel and M. Nafria. In IEEE International Reliability Physics Symposium (IRPS’18), 2018, pp. P-CR.6-1-P-CR.6-6.
    33. Aging-constrained Performance Optimization for Multi Cores. Heba Khdr; Hussam Amrouch and Jürg Henkel. In Proceedings of the 55th Annual Design Automation Conference (DAC’18), San Francisco, California, 2018, pp. 63:1--63:6.
    34. Reliability Estimations of Large Circuits in Massively-Parallel GPU-SPICE. V. M. van Santen; H. Amrouch and J. Henkel. In IEEE 24th International Symposium on On-Line Testing And Robust System Design (IOLTS’18), 2018, pp. 143–146.
    35. Estimating and Optimizing BTI Aging Effects: From Physics to CAD. Hussam Amrouch; Victor M. van Santen and Jörg Henkel. In Proceedings of the International Conference on Computer-Aided Design (ICCAD’18), San Diego, California, 2018, pp. 125:1--125:6.
    36. Dynamic Resource Management for Heterogeneous Many-cores. Jörg Henkel; Jürgen Teich; Stefan Wildermann and Hussam Amrouch. In Proceedings of the International Conference on Computer-Aided Design (ICCAD’18), San Diego, California, 2018, pp. 60:1--60:6.
    37. Hardware and software innovations in energy-efficient system-reliability monitoring. V. Tenentes; C. Leech; G. M. Bragg; G. Merrett; B. M. Al-Hashimi; H. Amrouch; J. Henkel and S. Das. In 2017 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’17), 2017, pp. 1–5.
    38. Towards aging-induced approximations. H. Amrouch; B. Khaleghi; A. Gerstlauer and J. Henkel. In 54th ACM/EDAC/IEEE Design Automation Conference (DAC’17), 2017, pp. 1–6.
    39. Impact of BTI on dynamic and static power: From the physical to circuit level. H. Amrouch; S. Mishra; V. van Santen; S. Mahapatra and J. Henkel. In 017 IEEE International Reliability Physics Symposium (IRPS’17), 2017, pp. CR-3.1-CR-3.6.
    40. Ultra-low power and dependability for IoT devices (Invited paper for IoT technologies). J. Henkel; S. Pagani; H. Amrouch; L. Bauer and F. Samie. In Design, Automation Test in Europe Conference Exhibition (DATE’17), 2017, pp. 954–959.
    41. Containing guardbands. H. Amrouch and J. Henkel. In 22nd Asia and South Pacific Design Automation Conference (ASP-DAC’17), 2017, pp. 537–542.
    42. Optimizing Temperature Guardbands. Hussam Amrouch; Behnam Khaleghi and Jörg Henkel. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’17), Lausanne, Switzerland, 2017, pp. 175--180.
    43. Special session: emerging (Un-)reliability based security threats and mitigations for embedded systems. H. Amrouch; P. Krishnamurthy; N. Patel; J. Henkel; R. Karri and F. Khorrami. In International Conference on Compilers, Architectures and Synthesis For Embedded Systems (CASES’17), 2017, pp. 1–10.
    44. Evaluating and Mitigating Degradation Effects in Multimedia Circuits. Hussam Amrouch and Jörg Henkel. In Proceedings of the 15th IEEE/ACM Symposium on Embedded Systems for Real-Time Multimedia (ESTIMedia’17), Seoul, Republic of Korea, 2017, pp. 61--67.
    45. Designing reliable, yet energy-efficient guardbands. J. Henkel and H. Amrouch. In IEEE International Conference on Electronics, Circuits and Systems (ICECS’16), 2016, pp. 540–543.
    46. Power and thermal management in massive multicore chips: Theoretical foundation meets architectural innovation and resource allocation. P. Bogdan; P. P. Pande; H. Amrouch; M. Shafique and J. Henkel. In 2016 International Conference on Compliers, Architectures, and Sythesis  of Embedded Systems (CASES’16), 2016, pp. 1–2.
    47. Stress-aware routing to mitigate aging effects in SRAM-based FPGAs. B. Khaleghi; B. Omidi; H. Amrouch; J. Henkel and H. Asadi. In 26th International Conference on Field Programmable Logic and Applications (FPL’16), 2016, pp. 1–8.
    48. Aging-aware voltage scaling. V. M. van Santen; H. Amrouch; N. Parihar; S. Mahapatra and J. Henkel. In 2016 Design, Automation Test in Europe Conference Exhibition (DATE’16), 2016, pp. 576–581.
    49. Reliability-aware design to suppress aging. H. Amrouch; B. Khaleghi; A. Gerstlauer and J. Henkel. In 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC’16), 2016, pp. 1–6, redHiPEAC Paper Award.
    50. Designing guardbands for instantaneous aging effects. V. M. van Santen; H. Amrouch; J. Martin-Martinez; M. Nafria and J. Henkel. In 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC’16), 2016, pp. 1–6, redHiPEAC Paper Award.
    51. Improving Mobile Gaming Performance Through Cooperative CPU-GPU Thermal Management. Alok Prakash; Hussam Amrouch; Muhammad Shafique; Tulika Mitra and Jörg Henkel. In 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC’16), Austin, Texas, 2016, pp. 47:1--47:6.
    52. Reliability degradation in the scope of aging -- From physical to system level. H. Amrouch and J. Henkel. In 10th International Design Test Symposium (IDT’15), 2015, pp. 9–12.
    53. Lucid infrared thermography of thermally-constrained processors. H. Amrouch and J. Henkel. In 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED’15), 2015, pp. 347–352.
    54. Connecting the physical and application level towards grasping aging effects. H. Amrouch; J. Martin-Martinez; V. M. van Santen; M. Moras; R. Rodriguez; M. Nafria and J. Henkel. In IEEE International Reliability Physics Symposium (IRPS’15), 2015, pp. 3D.1.1-3D.1.8.
    55. Towards interdependencies of aging mechanisms. H. Amrouch; V. M. van Santen; T. Ebi; V. Wenzel and J. Henkel. In 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD’14), 2014, pp. 478–485.
    56. hevcDTM: Application-driven Dynamic Thermal Management for High Efficiency Video Coding. D. Palomino; M. Shafique; H. Amrouch; A. Susin and J. Henkel. In Design, Automation Test in Europe Conference Exhibition (DATE’14), 2014, pp. 1–4.
    57. mDTM: Multi-objective dynamic thermal management for on-chip systems. H. Khdr; T. Ebi; M. Shafique; H. Amrouch and J. H. Karlsruhe. In Design, Automation Test in Europe Conference Exhibition (DATE’14), 2014, pp. 1–6.
    58. Analyzing the thermal hotspots in FPGA-based embedded systems. H. Amrouch; T. Ebi; J. Schneider; S. Parameswaran and J. Henkel. In 23rd International Conference on Field programmable Logic and Applications (FPL’13), 2013, pp. 1–4.
    59. Stress balancing to mitigate NBTI effects in register files. H. Amrouch; T. Ebi and J. Henkel. In 43rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN’13), 2013, pp. 1–10.
    60. Thermal management for dependable on-chip systems. J. Henkel; T. Ebi; H. Amrouch and H. Khdr. In 18th Asia and South Pacific Design Automation Conference (ASP-DAC’13), 2013, pp. 113–118.
    61. Accurate Thermal-Profile Estimation and Validation for FPGA-Mapped Circuits. A. Amouri; H. Amrouch; T. Ebi; J. Henkel and M. Tahoori. In IEEE 21st Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM’13), 2013, pp. 57–60, redHiPEAC Paper Award.
    62. COOL: Control-based Optimization of Load-balancing for Thermal Behavior. Thomas Ebi; Hussam Amrouch and Jörg Henkel. In Proceedings of the Eighth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS’12), Tampere, Finland, 2012, pp. 255--264.
    63. Self-Immunity Technique to Improve Register File Integrity Against Soft Errors. H. Amrouch and J. Henkel. In 2011 24th Internatioal Conference on VLSI Design (VLSID’11), 2011, pp. 189–194.
  1. 14th International Workshop on Boolean Problems (IWSBP), Keynote, virtual event in Sep 2020
  2. Peking University, Beijing, China in Jan 2020.
  3. University of Nebraska–Lincoln, Nebraska, USA in Feb 2020.
  4. The 11th Latin American Electron Devices Conference (LAEDC), Costa Rica in Feb, 2020.
  5. International Conference on Modelling, Simulation & Intelligent Computing (MoSICom), Keynote, Dubai in Jan 2020.
  6. EE Distinguished Speakers Seminar at EPFL, Lausanne, Switzerland in Dec 2019.
  7. The 32nd Symposium on Integrated Circuits and Systems Design (SBCCI) in August 2019.
  8. Federal University of Rio Grande do Sul (UFRGS), Brazil in April 2019.
  9. National Chiao Tung University, Hsinchu, Taiwan in March 2019.
  10. Macronix Company (semiconductor foundry), Taipei, Taiwan in March 2019.
  11. Tsinghua University, Beijing, China in March 2019.
  12. New York University (NYU), Abu Dhabi in UAE, February 2019.
  13. University of New South Wales, Sydney (UNSW), Australia in February 2019.
  14. Silvaco, Inc., Grenoble, France in April 2018.
  15. Korea University, Seoul in August 2018.
  16. Seoul National University in August 2017.
  1. “Steep-Slope Transistors: Opportunities and Challenges - Connecting Device Physics to System-level Management –” in Design Automation Conference (DAC. Together with Prof. Sayeef Salahuddin, University of California Berkeley, USA. Year: July 2020.
  2. “A Journey from Devices to Systems with FeFETs and NCFETs” in 25th Asia and South Pacific Design Automation Conference (ASP-DAC). Together with Prof. Sharon Hu from the University of Notre Dame, USA. Year: January 2020.
  3. “Design for Reliability on in the Nano-CMOS Era” in the 32nd Symposium on Integrated Circuits and Systems Design (SBCCI), Sao Paulo, Brazil. Full tutorial alone. Year: August 2019.
  4. “Negative Capacitance Transistor (NCFET) to Rescue Technology Scaling: From Physics to System Level” in the 34th South Symposium of Microelectronics and 21st South School of Microelectronics, Pelotas, Brazil. Full tutorial alone. Year: April 2019.
  5. “Design for Reliability in the Nano-CMOS Era: New Holistic Methodologies for Reliability Modeling and Optimization” in the International Asia and South Pacific Design Automation Conference (ASP-DAC), Tokyo, Japan. Together with Prof. Sheldon Tan from University of California, Riverside. Year: January 2019.
  6. “Design for Reliability: From Devices to Systems” in the 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, Czech Republic. Together with Prof. Montserrat Nafria from Universitat Autonoma de Barcelona. Year: July 2018.
  7. “Reliability: From Physics to CAD” in Design, Automation and Test in Europe (DATE), Dresden, Germany. Together with Prof. Montserrat Nafria from Universitat Autonoma de Barcelona and Prof. Norbert Wehn from TU Kaiserslautern. Year: March 2018.
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