Dieses Bild zeigt  Victor van Santen

Herr Dipl. Inform.

Victor van Santen

Wissenschaftlicher Mitarbeiter
Institut für Technische Informatik
Test und Diagnose von Halbleitersystemen

Kontakt

+49 711 685-88282
+49 711 685-88288

Pfaffenwaldring 47
D-70569 Stuttgart
Deutschland
Raum: 3.170

  1. 2021

    1. Containing Self-Heating Effects in Advanced Technologies. S. Salamin; V. van Santen; M. Rapp; J. Henkel and H. Amrouch. The Multidisciplinary Open Access Journal IEEE Access (IEEE Access’21) (2021).
  2. 2020

    1. Massively Parallel Circuit Setup in GPU-SPICE. V. van Santen; F. Florian Diep; J. Henkel and H. Amrouch. IEEE Transactions on Computers (TC’20) (2020).
    2. BTI and HCI Degradation in a Complete 32X64 bit SRAM Array – including Sense Amplifiers and Write Drivers – under Processor Activity. Victor van Santen; Simon Thomann; C. Pasupuleti; P. Genssler; N. Gangwar; U. Sharma; J. Henkel; S. Mahapatra and H. Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
    3. Modeling Emerging Technologies using Machine Learning:  Challenges and Opportunities. Florian Klemme; Jannik Prinz; Victor M. van Santen; Joerg Henkel and Hussam Amrouch. In IEEE/ACM 38th International Conference on Computer-Aided Design (ICCAD’20), 2020.
    4. Impact of Self-Heating On Performance, Power and Reliability in FinFET Technology. Victor M. van Santen; Paul R. Genssler; Om Prakash; S. Thomann; Jörg Henkel and Hussam Amrouch. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20, 2020.
    5. NCFET to Rescue Technology Scaling: Opportunities and Challenges. Hussam Amrouch; Victor M. van Santen; Girish Pahwa; Yogesh Chauhan and Jörg Henkel. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20), 2020.
  3. 2019

    1. New Worst-Case Timing for Standard Cells Under Aging Effects. Victor M van Santen; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Device and Materials Reliability (T-DMR’19) 19, 1 (2019), pp. 149--158.
    2. Modeling and Mitigating Time-Dependent Variability From the Physical Level to the Circuit Level. Victor M van Santen; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I’19) (2019).
    3. On the Workload Dependence of Self-Heating in FinFET Circuits. Victor M van Santen; Hussam Amrouch; Pooja Sharma and Jörg Henkel. IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II’19) (2019).
    4. Reliability Challenges with Self-Heating in FinFET Technology. H. Amrouch; V. M. van Santen; O. Prakash; H. Kattan; S. Salamin; S. Thomann and J. Henkel. In IEEE 25th International Symposium on On-Line Testing And Robust System Design (IOLTS’19), 2019.
    5. Modeling the Interdependences Between Voltage Fluctuation and BTI Aging. Sami Salamin; Victor M van Santen; Hussam Amrouch; Narendra Parihar; Souvik Mahapatra and Jörg Henkel. IEEE Transactions on Very Large Scale Integration Systems (TVLSI’19) (2019).
  4. 2018

    1. Reliability in Super- and Near-Threshold Computing: A Unified Model of RTN, BTI, and PV. V. M. van Santen; J. Martin-Martinez; H. Amrouch; M. M. Nafria and J. Henkel. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I’18) 65, 1 (2018), pp. 293–306.
    2. Weighted time lag plot defect parameter extraction and GPU-based BTI modeling for BTI variability. V. M. van Santen; J. Diaz-Fortuny; H. Amrouch; J. Martin-Martinez; R. Rodriguez; R. Castro-Lopez; E. Roca; F. V. Fernandez; J. Henkel and M. Nafria. In IEEE International Reliability Physics Symposium (IRPS’18), 2018, pp. P-CR.6-1-P-CR.6-6.
    3. Reliability Estimations of Large Circuits in Massively-Parallel GPU-SPICE. V. M. van Santen; H. Amrouch and J. Henkel. In IEEE 24th International Symposium on On-Line Testing And Robust System Design (IOLTS’18), 2018, pp. 143–146.
    4. Estimating and Optimizing BTI Aging Effects: From Physics to CAD. Hussam Amrouch; Victor M. van Santen and Jörg Henkel. In Proceedings of the International Conference on Computer-Aided Design (ICCAD’18), San Diego, California, 2018, pp. 125:1--125:6.
    5. Modeling and Evaluating the Gate Length Dependence of BTI. Victor M van Santen; Hussam Amrouch and Jörg Henkel. IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II’18) (2018).
  5. 2017

    1. Interdependencies of Degradation Effects and Their Impact on Computing. H. Amrouch; V. M. van Santen and J. Henkel. IEEE Design and Test Magazine (DNT’17) 34, 3 (2017), pp. 59–67.
    2. Impact of BTI on dynamic and static power: From the physical to circuit level. H. Amrouch; S. Mishra; V. van Santen; S. Mahapatra and J. Henkel. In 017 IEEE International Reliability Physics Symposium (IRPS’17), 2017, pp. CR-3.1-CR-3.6.
  6. 2016

    1. Designing guardbands for instantaneous aging effects. V. M. van Santen; H. Amrouch; J. Martin-Martinez; M. Nafria and J. Henkel. In 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC’16), 2016, pp. 1–6, redHiPEAC Paper Award.
    2. Aging-aware voltage scaling. V. M. van Santen; H. Amrouch; N. Parihar; S. Mahapatra and J. Henkel. In 2016 Design, Automation Test in Europe Conference Exhibition (DATE’16), 2016, pp. 576–581.
  7. 2015

    1. Connecting the physical and application level towards grasping aging effects. H. Amrouch; J. Martin-Martinez; V. M. van Santen; M. Moras; R. Rodriguez; M. Nafria and J. Henkel. In IEEE International Reliability Physics Symposium (IRPS’15), 2015, pp. 3D.1.1-3D.1.8.
  8. 2014

    1. Towards interdependencies of aging mechanisms. H. Amrouch; V. M. van Santen; T. Ebi; V. Wenzel and J. Henkel. In 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD’14), 2014, pp. 478–485.

Victor van Santen received the Dipl. Inform. (M.Sc.) degree in computer science in 2014 at the Karlsruhe Institute of Technology (KIT), where he is finalizing his Ph.D at the Chair for Embedded Systems (CES). He is a researcher at Chair for Semiconductor Test and Reliability (STAR). His research topics include microprocessor reliability estimation, circuit and transistor simulation, failure analysis and reliability estimation with a special interest in aging phenomena.

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