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- On the Reliability of FeFET On-Chip Memory. Paul R. Genssler; Victor M. van Santen; Joerg Henkel and Hussam Amrouch. IEEE Transactions on Computers (TC’21) (2021).
- BTI and HCI Degradation in a Complete 32X64 bit SRAM Array – including Sense Amplifiers and Write Drivers – under Processor Activity. Victor van Santen; Simon Thomann; C. Pasupuleti; P. Genssler; N. Gangwar; U. Sharma; J. Henkel; S. Mahapatra and H. Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
- Impact of Self-Heating On Performance, Power and Reliability in FinFET Technology. Victor M. van Santen; Paul R. Genssler; Om Prakash; S. Thomann; Jörg Henkel and Hussam Amrouch. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20, 2020.
Paul R. Genssler is pursuing his PhD under the supervision of Prof. Dr.-Ing. Hussam Amrouch at the Chair of Semiconductor Test and Reliability since 2020. Before that, he worked at the Chair for Embedded Systems at Karlsruhe Institute of Technology and the Chair for VLSI - Design, Diagnostics and Architecture at TU Dresden. He received his Diploma degree (Master's level) - with distinction - in Computer Science from TU Dresden in 2017.
His research interests include emerging non-volatile memories, programmable hardware, and machine learning for test methods for semiconductors.