Dieses Bild zeigt Paul R. Genssler

Paul R. Genssler

Herr Dipl.-Inf.

Wissenschaftlicher Mitarbeiter
Institut für Technische Informatik
Test und Diagnose von Halbleitersystemen

Kontakt

+49 711 685 88370
+49 711 685 88288

Pfaffenwaldring 47
D-70569 Stuttgart
Deutschland
Raum: 3.170

  1. 2024

    1. Frontiers in Edge AI with RISC-V: Hyperdimensional Computing vs. Quantized Neural Networks. Paul R. Genssler; Sandy A. Wasif; Miran Wael; Rodion Novkin and Hussam Amrouch. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’24), 2024.
    2. In-Memory Acceleration of Hyperdimensional Genome Matching on Unreliable Emerging Technologies. Hamza E. Barkam; Sanggeon Yun; Paul R. Genssler; Che-Kai Liu; Zhuowen Zou; Hussam Amrouch and Mohsen Imani. (2024). DOI: https://doi.org/10.1109/TCSI.2024.3351966
    3. Algorithm to Technology Co-Optimization for CiM-based Hyperdimensional Computing. Mahta Mayahinia; Simon Thomann; Paul R. Genssler; Christopher Münch; Hussam Amrouch and Mehdi B. Tahoori. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’24), 2024.
    4. HDCircuit: Brain-inspired Hyperdimensional Computing for Circuit Recognition. Paul R. Genssler; Lilas Alrahis; Ozgur Sinanoglu and Hussam Amrouch. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’24), 2024.
    5. WaSSaBi: Wafer Selection with Self-supervised Representations and Brain-inspired Active Learning. Karthik Pandaram; Paul R. Genssler and Hussam Amrouch. (2024). DOI: https://doi.org/10.1109/TCSI.2024.3357975
    6. DropHD: Technology/Algorithm Co-design for Reliable Energy-efficient NVM-based Hyperdimensional Computing under Voltage Scaling. Paul R. Genssler; Mahta Mayahinia; Simon Thomann; Mehdi Tahoori and Hussam Amrouch. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’24), 2024.
  2. 2023

    1. Modeling and Predicting Transistor Aging under Workload Dependency using Machine Learning. Paul R. Genssler; Hamza E. Barkam; Karthik Pandaram; Mohsen Imani and Hussam Amrouch. (2023). DOI: https://doi.org/10.1109/TCSI.2023.3289325
    2. FDSOI-based Analog Computing for Ultra-efficient Hamming Distance Similarity Calculation. Albi Mema; Simon Thomann; Paul R. Genssler and Hussam Amrouch. IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) (2023). DOI: https://doi.org/10.1109/TCSI.2023.3267837
    3. Learning-Oriented Reliability Improvement of Computing Systems From Transistor to Application Level. Behnaz Ranjbar; Florian Klemme; Paul R. Genssler; Hussam Amrouch; Jinhyo Jung; Shail Dave; Hwisoo So; Kyongwoo Lee; Aviral Shrivastava; Ji-Yung Lin; Pieter Weckx; Subrat Mishra; Francky Catthoor; Dwaipayan Biswas and Akash Kumar. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’23), Antwerp, Belgium, 2023.
    4. Cryogenic Embedded System to Support Quantum Computing: From 5nm FinFET to Full Processor. Paul R. Genssler; Florian Klemme; Shivendra Singh Parihar; Sebastian Brandhofer; Girish Pahwa; Ilia Polian; Yogesh Singh Chauhan and Hussam Amrouch. IEEE Transactions on Quantum Engineering (2023). DOI: https://doi.org/10.1109/TQE.2023.3300833
    5. Stress-resiliency of AI implementations on FPGAs. Jonas Krautter; Paul R. Genssler; Gloria Sepanta; Hussam Amrouch and Mehdi Tahoori. In International Conference on Field Programmable Logic and Applications (FPL), 2023.
    6. Reliable Hyperdimensional Reasoning on Unreliable Emerging Technologies. Hamza Errahmouni Barkam; Sanggeon Yun; Paul R. Genssler; Hanning Chen; Albi Mema; Andrew Ding; Hussam Amrouch and Mohsen Imani. In 2023 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2023.
    7. Challenges in Machine Learning Techniques to Estimate Reliability from Transistors to Circuits. Victor van Santen; Florian Klemme; Paul R. Genssler and Hussam Amrouch. In IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2023.
    8. Beyond von Neumann Era: Brain-inspired Hyperdimensional Computing to the Rescue. Hussam Amrouch; Paul R. Genssler; Mohsen Imani; Mariam Issa; Xun Jiao; Wegdan Ali Mohammadin; Gloria Sepanta and Ruixuan Wang. In 28th Asia and South Pacific Design Automation Conference (ASP-DAC), 2023.
    9. Tutorial: The Synergy of Hyperdimensional and In-memory Computing. Paul R. Genssler; Simon Thomann and Hussam Amrouch. In International Conference on Hardware/Software Codesign and System Synthesis (CODES/ISSS ’23 Companion), 2023.
    10. HDGIM: Hyperdimensional Genome Sequence Matching on Unreliable Highly-Scaled FeFET. Hamza Errahmouni Barkam; Sanggeon Yun; Paul R. Genssler; Zhuowen Zou; Che-Kai Liu; Hussam Amrouch and Mohsen Imani. In Proceedings of the Conference on Design, Automation & Test in Europe (DATE’23), Antwerp, Belgium, 2023.
    11. HW/SW Co-design for Reliable In-Memory Brain-Inspired Hyperdimensional Computing. Simon Thomann; Paul R. Genssler and Hussam Amrouch. IEEE Transactions on Computers (TC) (2023).
  3. 2022

    1. Intelligent Methods for Test and Reliability. Hussam Amrouch; Jens Anders; Steffen Becker; Maik Betka; Gerd Bleher; Peter Domanski; Nourhan Elhamawy; Thomas Ertl; Athanasios Gatzastras; Paul R. Genssler; Sebastian Hasler; Martin Heinrich; André van Hoorn; Hanieh Jafarzadeh; Ingmar Kallfass; Florian Klemme; Steffen Koch; Ralf Küsters; Andrés Lalama; Raphael Latty; Yiwen Liao; Natalia Lylina; Zahra Paria Najafi-Haghi; Dirk Pflüger; Ilia Polian; Jochen Rivoir; Matthias Sauer; Denis Schwachhofer; Steffen Templin; Christian Volmer; Stefan Wagner; Daniel Weiskopf; Hans-Joachim Wunderlich; Bin Yang and Martin Zimmermann. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2022, 2022, pp. 1–6.
    2. Brain-Inspired Computing for Circuit Reliability Characterization. Paul R. Genssler and Hussam Amrouch. Transactions on Computers (TC) (2022). DOI: https://doi.org/10.1109/TC.2022.3151857
    3. Brain-Inspired Hyperdimensional Computing: How Thermal-Friendly for Edge Computing? Paul Genssler; Austin Vas and Hussam Amrouch. IEEE Embedded Systems Letters (ESL’22) (2022).
    4. Wafer Map Defect Identification Based on the Fusion of Pattern and Pixel Information. Yiwen Liao; Raphael Latty; Paul R. Genssler; Hussam Amrouch and Bin Yang. In IEEE International Test Conference (ITC’22), 2022.
    5. Brain-Inspired Hyperdimensional Computing for Ultra-Efficient Edge AI. Hussam Amrouch; Mohsen Imani; Xun Jiao; Yiannis Aloimonos; Cornelia Fermuller; Dehao Yuan; Dongning Ma; Hamza Errahmouni; Paul R. Genssler and Peter Sutor. In Proceedings of the 2022 International Conference on Hardware/Software Codesign and System Synthesis, 2022.
    6. Design Close to the Edge in Advanced Technology using Machine  Learning and Brain-Inspired Algorithms. Hussam Amrouch; Florian Klemme and Paul R. Genssler. In 27th Asia and South Pacific Design Automation Conference  (ASP-DAC’22), 2022.
    7. All-in-Memory Brain-Inspired Computing using FeFET Synapses. Simon Thomann; Nguyen Hong Lam Giang; Paul R. Genssler and Hussam Amrouch. Frontiers in Electronics (2022). DOI: https://doi.org/10.3389/felec.2022.833260
  4. 2021

    1. Brain-Inspired Computing for Wafer Map Defect Pattern Classification. Paul R. Genssler and Hussam Amrouch. In IEEE International Test Conference (ITC’21), 2021.
    2. On the Reliability of FeFET On-Chip Memory. Paul R. Genssler; Victor M. van Santen; Joerg Henkel and Hussam Amrouch. IEEE Transactions on Computers (TC’21) (2021).
  5. 2020

    1. Impact of Self-Heating On Performance, Power and Reliability in FinFET Technology. Victor M. van Santen; Paul R. Genssler; Om Prakash; S. Thomann; Jörg Henkel and Hussam Amrouch. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20, 2020.
    2. BTI and HCI Degradation in a Complete 32X64 bit SRAM Array – including Sense Amplifiers and Write Drivers – under Processor Activity. Victor van Santen; Simon Thomann; C. Pasupuleti; P. Genssler; N. Gangwar; U. Sharma; J. Henkel; S. Mahapatra and H. Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.

Paul R. Genssler is pursuing his PhD under the supervision of Prof. Dr.-Ing. Hussam Amrouch at the Chair of Semiconductor Test and Reliability since 2020. Before that, he worked at the Chair for Embedded Systems at Karlsruhe Institute of Technology and the Chair for VLSI - Design, Diagnostics and Architecture at TU Dresden. He received his Diploma degree (Master's level) - with distinction - in Computer Science from TU Dresden in 2017.

His research interests include emerging non-volatile memories, programmable hardware, and machine learning for test methods for semiconductors.

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