Dieses Bild zeigt Paul R. Genssler

Paul R. Genssler

Herr Dipl.-Inf.

Wissenschaftlicher Mitarbeiter
Institut für Technische Informatik
Test und Diagnose von Halbleitersystemen

Kontakt

+49 711 685 88370
+4971168588288

Pfaffenwaldring 47
D-70569 Stuttgart
Deutschland
Raum: 3.170

  1. 2022

    1. Brain-Inspired Computing for Circuit Reliability Characterization. Paul R. Genssler and Hussam Amrouch. Transactions on Computers (TC) (2022). DOI: https://doi.org/10.1109/TC.2022.3151857
    2. Intelligent Methods for Test and Reliability. Hussam Amrouch; Jens Anders; Steffen Becker; Maik Betka; Gerd Bleher; Peter Domanski; Nourhan Elhamawy; Thomas Ertl; Athanasios Gatzastras; Paul R. Genssler; Sebastian Hasler; Martin Heinrich; André van Hoorn; Hanieh Jafarzadeh; Ingmar Kallfass; Florian Klemme; Steffen Koch; Ralf Küsters; Andrés Lalama; Raphael Latty; Yiwen Liao; Natalia Lylina; Zahra Paria Najafi-Haghi; Dirk Pflüger; Ilia Polian; Jochen Rivoir; Matthias Sauer; Denis Schwachhofer; Steffen Templin; Christian Volmer; Stefan Wagner; Daniel Weiskopf; Hans-Joachim Wunderlich; Bin Yang and Martin Zimmermann. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2022, 2022, pp. 1–6.
    3. Brain-Inspired Hyperdimensional Computing: How Thermal-Friendly for Edge Computing? Paul Genssler; Austin Vas and Hussam Amrouch. IEEE Embedded Systems Letters (ESL’22) (2022).
    4. All-in-Memory Brain-Inspired Computing using FeFET Synapses. Simon Thomann; Nguyen Hong Lam Giang; Paul R. Genssler and Hussam Amrouch. Frontiers in Electronics (2022). DOI: https://doi.org/10.3389/felec.2022.833260
    5. Wafer Map Defect Classification Based on the Fusion of Pattern and Pixel Information. Yiwen Liao; Raphaël Latty; Paul R. Genssler; Hussam Amrouch and Bin Yang. In IEEE International Test Conference (ITC’22), 2022.
    6. Design Close to the Edge in Advanced Technology using Machine  Learning and Brain-Inspired Algorithms. Hussam Amrouch; Florian Klemme and Paul R. Genssler. In 27th Asia and South Pacific Design Automation Conference  (ASP-DAC’22), 2022.
    7. Wafer Map Defect Identification Based on the Fusion of Pattern and Pixel Information. Yiwen Liao; Raphael Latty; Paul R. Genssler; Hussam Amrouch and Bin Yang. In IEEE International Test Conference (ITC’22), 2022.
  2. 2021

    1. On the Reliability of FeFET On-Chip Memory. Paul R. Genssler; Victor M. van Santen; Joerg Henkel and Hussam Amrouch. IEEE Transactions on Computers (TC’21) (2021).
    2. Brain-Inspired Computing for Wafer Map Defect Pattern Classification. Paul R. Genssler and Hussam Amrouch. In IEEE International Test Conference (ITC’21), 2021.
  3. 2020

    1. BTI and HCI Degradation in a Complete 32X64 bit SRAM Array – including Sense Amplifiers and Write Drivers – under Processor Activity. Victor van Santen; Simon Thomann; C. Pasupuleti; P. Genssler; N. Gangwar; U. Sharma; J. Henkel; S. Mahapatra and H. Amrouch. In Proceedings of the IEEE 58th International Reliability Physics Symposium  (IRPS’20), Dallas, Texas, U.S., Dallas, Texas, 2020.
    2. Impact of Self-Heating On Performance, Power and Reliability in FinFET Technology. Victor M. van Santen; Paul R. Genssler; Om Prakash; S. Thomann; Jörg Henkel and Hussam Amrouch. In 25th Asia and South Pacific Design Automation Conference (ASP-DAC’20, 2020.

Paul R. Genssler is pursuing his PhD under the supervision of Prof. Dr.-Ing. Hussam Amrouch at the Chair of Semiconductor Test and Reliability since 2020. Before that, he worked at the Chair for Embedded Systems at Karlsruhe Institute of Technology and the Chair for VLSI - Design, Diagnostics and Architecture at TU Dresden. He received his Diploma degree (Master's level) - with distinction - in Computer Science from TU Dresden in 2017.

His research interests include emerging non-volatile memories, programmable hardware, and machine learning for test methods for semiconductors.

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